ETECKSPACEHTCC Ceramic Substrate Design Input Guide
Define the material, stack-up, cavities, vias, metallization, tolerances, interfaces, and validation inputs needed for an HTCC substrate or package review.
Read the guideHTCC ENGINEERING & SOURCING
HTCC Ceramic Substrate Engineering & Sourcing Guides
From the structure of high-temperature co-fired ceramics to drawings, metallization, plating, and RFQ inputs, these guides help engineering and procurement teams turn an application into reviewable sourcing requirements.
CONTENT SCOPE
Content organized around real sourcing decisions
This knowledge center does not publish universal process limits or present common industry practices as a confirmed supplier capability. Trace, via, layer, tolerance, metallization, plating, and test ranges must be confirmed against the project drawing, material system, and written supplier feedback.
FOCUSED GUIDES
Start with the question in front of you
HTCC Metallization and Plating RFQ Guide
Understand the relationship between HTCC base metallization, surface plating, wire bonding, soldering, and brazing requirements before requesting a quote.
Read the guideHTCC RFQ Checklist for Drawings and Specifications
A practical HTCC ceramic substrate and package RFQ checklist covering drawings, material, layers, dimensions, metallization, quantity, testing, and target timing.
Read the guideWORKING PATH
From technical direction to a drawing-led HTCC RFQ
- 01
Understand the process
Assess whether HTCC fits the package, reliability, temperature, hermeticity, or multilayer interconnect direction.
- 02
Structure the inputs
Put material, stack-up, cavities, vias, metallization, dimensions, and interfaces into controlled drawings.
- 03
Define surface and assembly
Connect plating requirements to wire bonding, soldering, brazing, sealing, or other downstream interfaces.
- 04
Build the RFQ
Submit controlled files, volume, testing, packaging, and timing for a feasibility review.
GLOSSARY
Common terms in HTCC sourcing
- HTCC
- High Temperature Co-fired Ceramics.
- Green tape
- Unfired ceramic tape that can be punched, printed, stacked, and laminated before firing.
- Via
- A metallized opening that connects conductor layers.
- Cavity
- A recessed structure for a die, component, or package function.
- Metallization
- The metal system used for internal conductors, vias, pads, or sealing areas.
- Plating
- A surface finish applied to selected metal areas and specified against bonding, soldering, protection, or assembly requirements.